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Huawei HI-Series Power IC BGA Reballing Stencil

Huawei HI-series power IC rework net for BGA reballing; this is a separate product listing for the same stencil family and does not represent a different supplier.

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Commercial suitability

A single listed stencil is compatible with several specified Huawei power IC part numbers.

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Lists compatible IC part numbers

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Product-specific stencil for Huawei power IC repair

Pro tip: Validate the package layout and stencil alignment against the exact board and chip before using a replacement stencil.

Specifications

Compatible ICs HI6555, HI6553, HI6561, HI6422, HI6421GFC, HI6421B, HI6522, HI6551, HI6523
Product Type BGA reballing stencil
Use Huawei power IC repair
Model-specific stencil BGA Reballing Stencils & Kits

Compare more BGA Reballing Stencils & Kits suppliers, or see BGA Reballing Stencils & Kits suppliers in Shenzhen.

Supplier

E

ecufixtool.com

Product seller; manufacturer status not established by the page

🇨🇳 Shenzhen, Guangdong, China

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