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0.12MM MTK MT Series Power IC BGA Reballing Stencil Template

PHONEFIX MTK MT-series power IC BGA reballing stencil template listing.

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Commercial suitability

A 19-in-1 stencil template set covers several MTK power IC repair applications.

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19-in-1 MTK-series template listing

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Imported Japan steel sheet

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Heat-dissipating hole design

Pro tip: Confirm the exact IC model and ball pitch against the stencil pattern before purchase.

Specifications

Material Imported Japan steel sheet
Thickness 0.12 mm
Design Heat-dissipating holes
Set Size 19 in 1
Multi-IC coverage BGA Reballing Stencils & Kits

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Supplier

E

ecufixtool.com

Product seller; manufacturer status not established by the page

🇨🇳 Shenzhen, Guangdong, China

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