AI spec matching

QianLi MEGA-IDEA Black BGA Reballing Stencil For iPhone 6-14 Pro Max

QianLi MEGA-IDEA black steel BGA reballing stencil listing for iPhone CPU and IC repair.

Est. price range

Price on request

⚡ Sourcing insights

Commercial suitability

Multiple listed stencil options cover 0.3, 0.35, 0.4, and 0.5 mm pitches for iPhone IC work.

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Multiple pitch options listed: 0.3, 0.35, 0.4, and 0.5 mm

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Steel stencil listing

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Designed for iPhone CPU and IC reballing work

Pro tip: Select the hole pitch that matches the target chip; verify the exact model coverage and stencil option with the supplier.

Specifications

Material Steel
Listed Stencil Pitches 0.3, 0.35, 0.4, 0.5 mm
Application iPhone CPU and IC chip tin planting repair
Compatible Models iPhone 6 through 15 series, as listed
Multi-pitch stencil BGA Reballing Stencils & Kits

Compare more BGA Reballing Stencils & Kits suppliers, or see BGA Reballing Stencils & Kits suppliers in Shenzhen.

Supplier

E

ecufixtool.com

Product seller; manufacturer status not established by the page

🇨🇳 Shenzhen, Guangdong, China

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