Mbga-IP BGA Reballing Stencil Kit For iPhone 7 to 15 Pro Max
AMAOE Mbga-IP stencil platform kit for reballing and glue removal on compatible iPhone chips.
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Price on request
⚡ Sourcing insights
Commercial suitability
Combines tin planting and glue removal for iPhone CPU, NAND, Wi-Fi, and baseband repair.
Tin planting and glue removal in one design
Options include a 22-in-1 set and model-specific stencil kits
Listed for CPU, hard drive, Wi-Fi, baseband, and NAND repair
Pro tip: Match stencil openings and thickness to the chip and solder-ball pitch; confirm compatibility before ordering.
Specifications
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Supplier
ecufixtool.com
Product seller; manufacturer status not established by the page
🇨🇳 Shenzhen, Guangdong, China
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