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AMAO Xiaomi Mobile phone All Series BGA Reballing Stencil Template

AMAOE Xiaomi mobile phone BGA stencil template listing with multiple series-specific options.

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Price on request

⚡ Sourcing insights

Commercial suitability

Series options extend from MI:1 through MI:19, including listed Xiaomi and Redmi chip applications.

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Multiple Xiaomi stencil series listed, MI:1 to MI:19

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Includes listed CPU and NAND flash IC applications

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0.12 mm thickness shown for specified series options

Pro tip: Check the exact MI-series option and chipset compatibility; broad series coverage does not mean every stencil fits every device.

Specifications

Brand Amaoe
Series Options MI:1 to MI:19
Thickness 0.12 for listed MI:18 and MI:19 options mm
Application Xiaomi and Redmi motherboard BGA IC reballing
Broad Xiaomi series coverage BGA Reballing Stencils & Kits

Compare more BGA Reballing Stencils & Kits suppliers, or see BGA Reballing Stencils & Kits suppliers in Shenzhen.

Supplier

E

ecufixtool.com

Product seller; manufacturer status not established by the page

🇨🇳 Shenzhen, Guangdong, China

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