Amaoe Multiple Holes BGA Reballing Stencil Template
Multi-hole BGA reballing stencil template suitable for various chip sizes, enabling efficient ball placement for high-volume repair operations in mobile and electronics workshops.
Est. price range
US$5.00
Min. order
1 pcs
⚡ Sourcing insights
Commercial suitability
You need a versatile multi-hole BGA stencil for varied chip reballing jobs.
Multiple-hole design supports different BGA layouts
Reusable metal stencil for professional repair environments
Offered by a wholesale mobile phone repair tools store
Compatible with common mobile and electronics chips
Pro tip: For universal stencils, verify supported pitch and grid sizes against your target BGA packages.
Detailed specifications will be shared by the supplier in their official quote.
Include your exact spec requirements in the RFQ note.
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Supplier
China Phonefix (DIYFixTool)
Retailer
🇨🇳 Guangdong, China
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