Universal BGA Reballing Stencil Kit with Solder Balls and Flux
Universal multi-size BGA reballing stencil kit supplied with matching solder balls and flux for a range of laptop and game console chip packages.
Price Range
Price on request
⚡ AI Sourcing Insights
Why Buy
You want a universal BGA kit with templates, balls and flux for varied repair jobs.
Universal stencil layout supporting multiple BGA package sizes
Includes solder balls matched to stencil apertures
Kit includes flux to simplify the reballing process
Targeted for repair of laptops and game consoles
💡 Pro Tip: When selecting universal BGA kits, ensure ball diameter matches stencil aperture and pad size.
Detailed specifications will be shared by the supplier in their quote.
Include your spec requirements in the RFQ for the best match.
Supplier
Shenzhen Qianli Innovation Technology Co., Ltd.
Manufacturer
🇨🇳 Shenzhen, Guangdong, China
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