AMAOE 0.12mm BGA Reballing Stencil for Laptop Power Supply Chip
Thin 0.12 mm BGA reballing stencil suitable for power supply chips and similar BGA packages, useful for technicians handling reflow and reballing operations.
Est. price range
US$4.00
Min. order
1 pcs
⚡ Sourcing insights
Commercial suitability
You want a thin BGA stencil that speeds up laptop chip reballing.
0.12 mm thickness for rapid heating and cooling during reballing
Designed for laptop power supply chips and similar BGA packages
Sold via a specialist mobile phone repair tools wholesale store
Supports repetitive use in repair workshops
Pro tip: When choosing BGA stencils, check thickness; thinner stencils heat faster but require careful handling.
Detailed specifications will be shared by the supplier in their official quote.
Include your exact spec requirements in the RFQ note.
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Supplier
China Phonefix (DIYFixTool)
Retailer
🇨🇳 Guangdong, China
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