AMAOE 0.12mm BGA Reballing Stencil for Laptop Power Supply Chip
Thin 0.12 mm BGA reballing stencil suitable for power supply chips and similar BGA packages, useful for technicians handling reflow and reballing operations.
Price Range
$4.00 (≈ ₹335 indicative, 21 Sep)
Min Order
1 pcs
⚡ AI Sourcing Insights
Why Buy
You want a thin BGA stencil that speeds up laptop chip reballing.
0.12 mm thickness for rapid heating and cooling during reballing
Designed for laptop power supply chips and similar BGA packages
Sold via a specialist mobile phone repair tools wholesale store
Supports repetitive use in repair workshops
💡 Pro Tip: When choosing BGA stencils, check thickness; thinner stencils heat faster but require careful handling.
Detailed specifications will be shared by the supplier in their quote.
Include your spec requirements in the RFQ for the best match.
Supplier
China Phonefix (DIYFixTool)
Retailer
🇨🇳 Guangdong, China
Zero spam — mutual consent only.
Free · No commitment · AI-matched
Mutual Consent
No spam guaranteed
Zero Commission
For buyers & sellers
Ready to source AMAOE 0.12mm BGA Reballing Stencil for Laptop Power Supply Chip?
Get an official quote directly from China Phonefix (DIYFixTool). Fast, secure, and no commitment.
Avg. response timeout: 4 Hours