PA-300A03-509A Sinter Copper Electrode
Copper electrode sheet for chip top-side interconnection, compatible with ultrasonic bonding of 300–400 μm copper wire and suitable for SiC and IGBT module packaging.
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Commercial suitability
Copper wire bonding compatibility and ≥250 W/m·K thermal conductivity are specified.
Compatible with ultrasonic bonding of 300–400 μm copper wire
Specified thermal conductivity of at least 250 W/m·K
Lead-free, halogen-free, and flux-free
Designed for SiC and IGBT module packaging
Pro tip: For sintered copper interconnect materials, confirm the required sintering atmosphere, temperature, pressure, and interface compatibility for your assembly process.
Specifications
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xinyuanmat.cn
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🇨🇳 Shenzhen, Guangdong, China
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