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IoT Devices PCB Assembly Services

IoT device PCB assembly for connected products, including smart home, wearable, healthcare, and industrial applications.

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Price on request

โšก Sourcing insights

Commercial suitability

Supports 0201 components, rigid-flex boards, and prototype-to-volume IoT assembly.

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Supports rigid, flexible, and rigid-flex boards

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Handles passive components down to 0201 size

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Offers AOI, X-ray, and flying-probe inspection

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Supports prototype and pilot builds before volume production

Pro tip: For compact IoT assemblies, verify component pitch, board outline, and inspection requirements against the assemblerโ€™s documented limits.

Specifications

Assembly Types SMT, BGA, uBGA/Micro BGA, CSP
Component Capability Passive components down to 0201; fine-pitch components to 0.05 mm
PCB Types Rigid, flexible, rigid-flex
Testing And Inspection AOI, X-ray inspection and analysis, flying probe testing, microscopic inspection up to 20X
Maximum PCB Size 509 ร— 430 mm
Quality Credentials ISO 9001:2015 quality management system; IPC-A-610 certified personnel
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Supplier

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suntronicinc.com

Electronics manufacturing services provider

๐Ÿ‡บ๐Ÿ‡ธ Texas, United States

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