AI spec matching

IoT Devices PCB Assembly Service — Suntronic

IoT-device PCB assembly services, from design review and prototypes through production, testing, and delivery.

Est. price range

Price on request

⚡ Sourcing insights

Commercial suitability

Supports fine-pitch components down to 0.05 mm and inspection with AOI and X-ray.

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SMT, BGA, micro-BGA, and CSP assembly

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Supports rigid, flexible, and rigid-flex boards

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AOI, X-ray, flying-probe, and microscopic inspection

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Prototype and pilot builds available

Pro tip: For compact IoT boards, confirm component pitch and ask how inspection covers hidden BGA solder joints.

Specifications

PCB Assembly Types SMT, BGA, uBGA/Micro BGA, CSP
Component Capabilities Passive components down to 0201; fine-pitch components to 0.05 mm
Testing And Inspection AOI, X-ray inspection and analysis, flying probe testing, microscopic inspection up to 20X
PCB Types Rigid, flexible, rigid-flex
Maximum PCB Size 509 × 430 mm
Quality System ISO 9001:2015; IPC-A-610 certified personnel
IoT Assembly Specialist iot pcb assembly

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Supplier

S

suntronicinc.com

Electronics manufacturing services provider

🇺🇸 Texas, United States

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