1GE,10G,40G,100G Optic Module, AOC,DAC Cable

The optical module is the core component of optical power/electrical conversion, which includes the actual optical conversion device (TOSA), optical receiver device (ROSA), and external optical path. From the packaging technology perspective, the optical module at the communication level uses To-can or BOX packaging technology with high-density integration, while the optical module in data centers often uses COB (Chip on Board) packaging technology. With the development of advanced optical technology, through high-density integration of advanced optical chips, it can integrate testers, high-speed controllers, pumps, and splitter devices on the same chip base, realizing the simplification and cost reduction of technology, and aiming to achieve more optical chips to enhance integration. The advanced optical technology is becoming a definite trend for short-distance optical applications. In the COB and applicable advanced optical technology processes, the chip bonding technology requires attention to positioning accuracy, adhesion strength, and thermal stability. For high-power-consuming optical chips such as lasers and drivers, high work temperature will increase the aging, degradation, and thermal effects of optical modules, thus shortening their lifespan, which is a key battle in manufacturing. To address issues such as thermal dissipation and optical stability, PUSMAI utilizes high-performance adhesive materials, such as ultra-high thermal conductivity adhesive, low-receiving UV adhesive, and high thermal conductivity interface materials, etc. The optical module product speed upgrade is continuously accelerating, and the current 400G optical module has become a strong force in the market, while the 800G optical module is expected to become mainstream by 2025. PUSMAI provides high stability and compatibility optical modules, with product series ranging from 1.25G, 10G, 40G, 100G, 400G, DAC, ACO, etc.

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