PHONEFIX Amaoe BGA Reballing Stencil EMMC EMCP UFS Positioning Platform
Magnetic BGA reballing and positioning platform for EMMC, EMCP and UFS IC packages, providing accurate alignment for IC reballing work in phone and electronics repair.
Est. price range
Price on request
⚡ Sourcing insights
Commercial suitability
You frequently reball EMMC or UFS ICs and need accurate positioning support.
Dedicated positioning platform for EMMC, EMCP and UFS ICs
Supports BGA reballing with accurate IC alignment
From Phonefix brand focused on phone repair tooling
Part of an extensive BGA reballing platform product line
Pro tip: For IC reballing platforms, check compatibility with package types (EMMC, UFS, BGA size) to ensure stable clamping and heat resistance.
Detailed specifications will be shared by the supplier in their official quote.
Include your exact spec requirements in the RFQ note.
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Supplier
China Phonefix (DIYFixTool)
Retailer
🇨🇳 Guangdong, China
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